聚焦先进封装与前道配套，以两岸协作驱动半导体光刻胶材料国产替代。

Driving domestic substitution of semiconductor photoresist materials — focused on advanced packaging & front-end ancillary chemistry, powered by cross-strait collaboration.

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Positioning

两岸协作的半导体材料国产化平台 A cross-strait platform for domestic semiconductor materials

以「台湾成熟技术背书 ＋ 大陆本地研发生产交付」双轮驱动，解决国内 Tier-1 晶圆厂与封测厂的供应链安全顾虑，呼应国家半导体材料国产替代战略。采轻资产启动、分阶段扩张，每一阶段以实际营收与客户验证为前提。

Twin-engine model — mature Taiwan technology endorsement plus local R&D and delivery in mainland China — addressing the supply-chain security concerns of domestic Tier-1 fabs and OSAT players. Asset-light launch, staged expansion, each phase gated by real revenue and customer validation.

10+ 年
国际顶尖光刻材料
研发实战经验
years of top-tier photoresist R&D
2 岸
台湾技术 × 大陆
本地生产交付
Taiwan tech × mainland delivery
3 大
产品线协同
布局
synergistic product lines
2 h
长三角客户
快速响应
Yangtze-Delta response time
Product Lines

三大产品线协同布局Three synergistic product lines

01

先进封装材料Advanced Packaging Materials

AI 需求驱动 · 增长潜力大
AI-driven · high growth
  • CoWoS / HBM 清洗剂 — 对应 AI 芯片先进封装的清洗需求
  • RDL 光刻胶 — 重布线层关键材料
  • TGV 光刻胶 — 玻璃通孔先进封装制程
  • CoWoS / HBM cleaners — for AI-chip advanced packaging
  • RDL photoresist — redistribution-layer key material
  • TGV photoresist — through-glass-via packaging process
02

前道配套材料Front-End Ancillary Materials

应用广泛 · 稳定现金流
broad application · steady cash flow
  • BARC / TARC — 底部 / 顶部抗反射涂层
  • 认证基础 — 依托核心团队联电供应链导入经验推进认证
  • 稀释加工 — 以本地化加工同步推动先进封装与前道材料研发
  • BARC / TARC — bottom / top anti-reflective coatings
  • Qualification base — advancing via the team's UMC supply-chain experience
  • Local processing — dilution & processing to support parallel R&D
03

电子化学品贸易Electronic Chemicals Trade

支撑研发 · 降低初期亏损
funds R&D · de-risks early stage
  • 轻资产启动 — 以贸易启动现金流，支持自有材料研发
  • 供应链整合 — 整合两岸电子化学品供应资源
  • 分阶段扩张 — 贸易 → 稀释加工 → 中型量产 → 整合生产
  • Asset-light start — trade-led cash flow funding in-house R&D
  • Supply-chain integration — cross-strait electronic-chemical sourcing
  • Staged scale-up — trade → processing → mid-volume → integrated mfg.
01 02 03
Core Strengths

技术、客户、团队三位一体Technology, customers & team in one

01 · 技术TECHNOLOGY

顶尖供应链导入经验Top-tier supply-chain track record

核心团队具备导入台积电、联电先进制程材料供应链的实战经验，对接国际顶尖客户的品控标准。

Hands-on experience qualifying advanced-process materials into the TSMC and UMC supply chains, aligned to top-tier customer quality standards.

02 · 客户CUSTOMERS

成熟客户网络A mature customer network

已与国内先进封测客户建立深度合作意向，核心团队现有客户覆盖国内半导体及显示行业头部企业，验证周期可显著缩短。

Deep-collaboration intent established with leading domestic OSAT customers; the team's existing network spans head-player semiconductor and display companies, materially shortening qualification cycles.

03 · 团队TEAM

国际级研发团队A world-class R&D team

20+ 年半导体与显示行业专用化学材料研发经验，曾服务于台积电、联电、美光、日月光、欣邦、长电等供应链体系。

20+ years in specialty chemicals for the semiconductor and display industries, with service across the TSMC, UMC, Micron, ASE, and JCET supply chains.

TSMC 供应链标准standards
UMC 认证推进中qualification
本地化Localized 研发生产R&D + mfg.
长三角Yangtze-Delta 2h 响应response
Market Opportunity

市场高速增长 × 国产化率偏低 ＝ 明确的国产替代窗口期Fast-growing market × low localization = a clear window for domestic substitution

<10%
高端光刻胶 / 清洗剂 / 剥离剂国产化率，供应链高度依赖进口
localization rate for high-end photoresist / cleaners — heavily import-dependent
17%
中国光刻胶市场规模年复合增长率（2025–2030 预测）
CAGR of China's photoresist market (2025–2030 forecast)
90%+
高端材料依赖日本、美国、台湾进口，国产替代迫在眉睫
of high-end materials imported from Japan, US & Taiwan — substitution is urgent
数据来源：中国电子材料行业协会、海关总署、深企投产业研究院
Sources: China Electronic Materials Industry Association; General Administration of Customs; public industry research.
Contact

携手共建半导体材料国产替代标杆Build the benchmark for domestic semiconductor materials with us

欢迎晶圆厂、封测厂、材料同业与投资伙伴交流合作。

We welcome dialogue with fabs, OSAT players, materials peers and investment partners.

联系我们Get in touch